High Density Interconnect (HID) PCB is one of the fastest growing technologies in PCBs. High density interconnect boards contain blind and buried vias and often contain microvias of 0.006 or less in diameter. They have a higher circuitry density than traditional circuit boards. The evolution of high-density PCB technology has given engineers greater design freedom and flexibility than ever before. Designers using high density interconnect methods can place more components on both sides of the raw PCB if desired. In essence, an high density interconnect PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This means that a high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality.
The factors that drive the global high density interconnect (HID) PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. The factors such as rising trend toward sophisticated safety systems, autonomous driving, and miniaturization of electronic devices in the automobile sector are expected to boost the growth of the global HDI PCB market in the near future. In addition, increase in utilization of high density interconnect technology in healthcare is expected to provide lucrative growth opportunities for the high density interconnect (HID) PCB market. On the contrary, high construction cost is anticipated to restrain the growth of the global high density interconnect (HID) PCB market.
The global high density interconnect (HID) PCB market is segmented on the basis of application, industry vertical, and geographical region. On the basis of application, the market is segmented into mobile phones, touch-screen devices, laptop computers, digital cameras, engine control units, GPS, dashboard electronics and 4G network communications. The high density interconnect PCB is also prominently featured in medical devices, as well as various electronic aircraft parts and components.
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Currently, application of these boards in consumer electronic devices such as smartphones, smart wearable, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global high density interconnect (HID) PCB market is projected to grow in the forecast period. By geographical region the global high density interconnect (HID) PCB market is split up into North America, Europe, Asia Pacific, Middle East & Africa and South America. Asia Pacific is expected to have largest market share during estimated period and is expected to witness significant growth owing to the presence of large manufacturing of electronics companies in this region. The region, along with Europe, is one of the developers in adopting new technologies, which is also one of the key factors for the high CAGR in this region.
Acquisitions and Merger, new product introductions, investments, and corporations & developments are the key strategies adopted by market companies to ensure their growth in the high density interconnect (HID) PCB market. The key players are Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, TTM Technologies, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporation, Epec, LLC, and Meiko are some major players in the high density interconnect (HID) PCB market.
